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Senior Front-End Central Product Integration Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

On-site

SGD 65,000 - 85,000

Full time

Today
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Job summary

A leading semiconductor company is seeking a Front End Central Product Integration Engineer in Singapore. This role involves driving silicon node’s Packaging Product yield and quality improvement through technical expertise and project management. Responsibilities include promoting global synergy, defining strategies for Packaging Technology, and leading taskforce to optimize yield performance. Candidates should possess a relevant degree, at least 2 years of experience in semiconductor processing, and strong analytical and interpersonal skills.

Qualifications

  • Minimum of 2 years of experience in Back‑End‑of‑Line (BEOL) semiconductor processing or process integration.
  • Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test, and probe yield.
  • Experience on DRAM HPM, BEOL integration, and advanced packaging is a plus.

Responsibilities

  • Promote global project management for improved benchmark performance.
  • Define strategies for Packaging Technology interaction with Front End manufacturing.
  • Lead the PI Loop taskforce to optimize process flow and achieve yield performance.

Skills

Data analysis
Troubleshooting
Problem solving
Presentation skills
Communication skills
Interpersonal skills

Education

Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering, or related field

Tools

Microsoft Office
Job description
A leading semiconductor company is seeking a Front End Central Product Integration Engineer in Singapore. This role involves driving silicon node’s Packaging Product yield and quality improvement through technical expertise and project management. Responsibilities include promoting global synergy, defining strategies for Packaging Technology, and leading taskforce to optimize yield performance. Candidates should possess a relevant degree, at least 2 years of experience in semiconductor processing, and strong analytical and interpersonal skills.
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