R&D Scientist - Co-Packaged Optics (NSTIC)

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading research institute in Singapore is seeking an experienced engineer to develop package-level optical interconnects for advanced Co-Packaged Optics. The ideal candidate will have a strong background in optical interconnect modeling and at least 5 years of relevant experience, holding an MS or Ph.D. in Engineering or Physics. Responsibilities include designing lenses for optical I/Os and simulating hybrid bonding interfaces. This role demands excellent teamwork and communication skills.

Qualifications

• At least 5 years of relevant experience.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling.

Responsibilities

• Develop package-level optical interconnects for advanced Co-Packaged Optics.
• Simulate the impact of hybrid bonding interfaces.
• Design silicon and alternative-material lenses for optical I/Os.

Skills

Optical interconnect modeling

Microscope-based alignment

Communication skills

Teamwork

Education

MS or Ph.D in Engineering or Physics

Tools

Optical testing tools

Metrology tools

Job description

Job Description

• Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
• Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
• Design silicon and alternative-material lenses for optical I/Os in wafer-scale integration.
• Estimate optical losses between grating/edge couplers and fiber interfaces via lens structures.
• Design package level/wafer-level optical interconnects between GPU-GPU and GPU-memory for multi-chiplet heterogeneous integration packages.
• Develop passive fiber alignment structures and techniques for high-density optical coupling.
• Evaluate fiber array assemblies with CPO test vehicles.
• Generate package design and test plans to prototype and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.
• Propose innovative ideas to improve the state of the art in optical interconnects and testing.

Job Requirements

• MS or Ph.D in Engineering or Physics with at least 5 years of relevant experience.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
• Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
• Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
• Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
• Proficiency with microscope-based alignment, metrology, and optical loss measurements.
• Strong communication, teamwork, and technical reporting skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.