Process Technician (Grinding, Polishing & CMP – Diamond Substrates)

TECNISCO ADVANCED MATERIALS PTE. LTD.; Singapore; On-site; SGD 35,000 - 50,000; Full time

Job summary

A leading technology company based in Singapore is searching for a detail-oriented Process Technician. This role involves supporting grinding, polishing, and chemical mechanical polishing operations on diamond substrates. Responsibilities include operating equipment, ensuring quality standards, and collaborating with engineers on R&D and production. Ideal candidates should have a diploma in a relevant field and strong English skills, with experience in semiconductor processes advantageous.

Benefits

Training in MPCVD diamond growth

Career development pathways

Collaborative work culture

Qualifications

• Prior experience with vacuum systems, thin film deposition, or semiconductor processes is advantageous.
• Comfortable working with plasma tools, high-temperature systems, or precision instruments.

Responsibilities

• Operate and monitor grinding, lapping, polishing, and CMP equipment according to standard operating procedures.
• Prepare diamond substrates and consumables for processing runs.
• Perform surface quality inspections using optical tools, profilometers, and microscopes.

Skills

Detail-oriented

Team player

Adaptable

Fluent in English

Education

Diploma / Higher NITEC in Engineering, Materials, Electronics or related

Job description

About the Role

We are looking for a detail-oriented Process Technician to support grinding, polishing, and chemical mechanical polishing (CMP) operations for MPCVD-grown diamond substrates. You will play an essential role in day-to-day equipment operation, surface finishing, and quality checks to ensure diamond wafers meet stringent requirements for semiconductor and thermal management applications. This role supports both R&D experiments and pilot production.

Key Responsibilities

• Operate and monitor grinding, lapping, polishing, and CMP equipment according to standard operating procedures (SOPs).
• Prepare diamond substrates and consumables (pads, slurries, abrasives) for processing runs.
• Perform surface quality inspections using optical tools, profilometers, and microscopes.
• Record process data accurately and report deviations to engineers.
• Assist engineers in process development, troubleshooting, and experiments.
• Carry out routine maintenance, calibration, and cleaning of polishing/CMP equipment.
• Ensure safe operations in a cleanroom or laboratory environment, following EHS standards.

Requirements

• Diploma / Higher NITEC in Engineering, Materials, Electronics, or related technical discipline.
• Prior experience with vacuum systems, thin film deposition, or semiconductor processes is advantageous.
• Comfortable working with plasma tools, high-temperature systems, or precision instruments.
• Detail-oriented, reliable, and able to follow SOPs and safety protocols.
• Team player, adaptable, and eager to learn in both R&D and production environments.
• Fluent in English (spoken and written). Proficiency in Mandarin and Japanese is an advantage for cross-border collaboration

What We Offer

• Training in MPCVD diamond growth and advanced materials processing.
• Career development pathways into engineering, technical specialist, or supervisory roles.
• Involvement across the value chain — from lab-scale R&D to production support.
• Dynamic and collaborative work culture at the forefront of deep-tech innovation.