Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Micron Semiconductors; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an Advanced Packaging Integration Engineer to develop innovative packaging technologies. The role involves improving product quality, driving yield enhancements, and collaborating with various engineering teams. Candidates should have 2+ years of semiconductor integration experience and proficiency in Python, R, and SQL. This position offers an exciting opportunity to shape the future of advanced memory technologies.

Qualifications

• 2+ years of semiconductor process integration experience.
• Strong understanding of process flows and interactions.
• Proficient in statistical analysis and process modeling.

Responsibilities

• Develop advanced packaging technologies for various processes.
• Drive yield improvement through silicon package integration.
• Collaborate with teams to execute technology development strategies.

Skills

Python

R

SQL

Data analytics

Visual Basic

Process integration

Education

B.S/M.S./Ph.D. in relevant engineering or technical field

Tools

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Key responsibilities and duties include:

Technology Development:

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams

Yield Improvement:

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
• 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes