Package Health - Senior Manager/Manager, Advanced Packaging Technology Development

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Package Health Manager/Senior Manager to lead a team focused on package health monitoring and diagnostics. The ideal candidate should have 7+ years of experience in semiconductor packaging and a strong technical background in simulation and data analytics. Competitive salary and benefits are offered in a dynamic work environment.

Qualifications

• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred).
• Experience defining test architectures and managing test/probe yield.
• Strong knowledge of semiconductor packaging process and material properties.

Responsibilities

• Manage engineering teams responsible for package health monitoring and diagnostics.
• Drive implementation of DFT methodologies and test coverage strategies.
• Lead simulation studies for mechanical stress and thermal behavior.

Skills

Semiconductor packaging

Test coverage strategies

Failure detection

Data analytics

Team management

Education

Master's or Bachelor's degree in Electrical Engineering or Materials Science

Tools

Simulation tools

Data analytics platforms

Job description

The Package Health Manager/Senior Manager will lead a team of engineers focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions.

Key Responsibilities

• Manage engineering teams responsible for package health monitoring and diagnostics.
• Drive implementation of DFT methodologies and test coverage strategies.
• Lead simulation studies for mechanical stress, thermal behavior, and electrical performance.
• Coordinate development of engineering solutions for failure detection and prevention.
• Collaborate with IT and data science teams to deploy analytics dashboards and models.
• Support qualification and reliability testing for new packaging technologies.

Qualifications

• Master's or Bachelor's degree in Electrical Engineering, Materials Science or related field.
• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred).
• Experience defining test architectures, coverage, and managing test/probe yield.
• Experience in package simulation and characterization (mechanical, thermal, electrical).
• Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes.
• Strong knowledge of semiconductor packaging process, material interaction and properties.
• Experience managing technical teams and cross-functional projects.
• Knowledge of simulation tools and data analytics platforms.

Additional/Preferred Qualifications

• Familiarity with AI/ML applications in manufacturing or reliability.
• Experience with package characterization techniques and standards.
• Proven problem-solving and multitasking skills.
• Strong communication and stakeholder management skills.