NTI NAND Senior/Principal Process Integration Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Senior/Principal NAND Module Process Integration Engineer to design and implement innovative process solutions for 3D NAND product yield and quality. The ideal candidate is passionate about semiconductor technology, has strong data analysis skills, and excels in cross-functional collaboration. An advanced degree in Electrical Engineering or a related field and experience in the semiconductor industry are essential. This role requires effective communication and the ability to lead projects to successful completion.

Qualifications

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to travel for extended periods to the US for collaborative R&D work.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps.
• Develop or redefine CSPEC criteria for optimal product performance.
• Coordinate activities at the manufacturing site for funding experiments.
• Undertake development projects to evaluate and implement new integration schemes.
• Take on a leadership role at quarterly yield summits.
• Assist in the transfer of new technology from R&D to manufacturing.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication

Self-motivation

Education

Masters/PhD in Electrical Engineering

Masters/PhD in Nanoscience

Masters/PhD in Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self‑motivated, and self‑governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work.
• A strong aptitude for research, demonstrated through publications and patents, is essential.

Preferred to have Skills / Experiences as below:

• Proficiency in ing/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end‑to‑end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Education

Masters/PhD in Electrical Engineering, Nanoscience, Material Science or a related field.