Materials Engineer, R&D — Intermetallics & Coatings

TDCONNEX EASTERN PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading materials research firm in Singapore is seeking a Materials Engineer to focus on the development and process optimization of high-performance intermetallic compounds. The ideal candidate will utilize techniques such as SEM and EDX for microstructural analysis, assist in surface engineering, and maintain meticulous experimental records. A Bachelor's or Master's degree in Materials Science or related fields and experience in a metallurgical lab are required. Bilingual proficiency in English and Mandarin is preferred, with approximately 50% travel required.

Qualifications

• 1–3 years of hands-on experience in a metallurgical lab or R&D environment.
• Experience with statistical process control (SPC).
• Requires frequent travel, with 50% time in Singapore and 50% overseas.

Responsibilities

• Utilize SEM, EDX, and XRD to analyze grain boundaries and phase distributions.
• Assist in developing coating and plating solutions.
• Maintain meticulous records of experimental parameters and correlate variables.

Skills

Microstructural Analysis

Surface Engineering

Data Synthesis

Familiarity with powder metallurgy techniques

Precision measurement tools

Bilingual proficiency in English and Mandarin

Education

Bachelor’s or Master’s degree in Materials Science, Metallurgy, or Applied Physics

Job description

A leading materials research firm in Singapore is seeking a Materials Engineer to focus on the development and process optimization of high-performance intermetallic compounds. The ideal candidate will utilize techniques such as SEM and EDX for microstructural analysis, assist in surface engineering, and maintain meticulous experimental records. A Bachelor's or Master's degree in Materials Science or related fields and experience in a metallurgical lab are required. Bilingual proficiency in English and Mandarin is preferred, with approximately 50% travel required.