Laser Bonding Engineer ( Semiconductor Packaging ) | Up to $8000 - Y11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading HR advisory firm in Singapore is seeking a Laser-Assisted Bonder (LAB) Process Engineer. You will be responsible for developing and optimizing laser bonding processes, particularly in advanced packaging applications. The ideal candidate has a degree in engineering and at least 2-5 years of experience in semiconductor packaging. This position offers a competitive salary range of $6000 - $8000, depending on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging.
• Familiarity with laser or optical systems is necessary.
• Excellent troubleshooting and risk analysis skills.

Responsibilities

• Develop and optimize laser-assisted bonding processes.
• Qualify new laser bonding processes from R&D to production.
• Troubleshoot laser systems to resolve yield and quality issues.

Skills

Laser Assisted bonding technologies

Troubleshooting

Risk analysis

Statistical analysis (JMP, Minitab)

Advanced process control

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Tools

X-ray

SAM

OM

Job description

Position title : Laser-Assisted Bonder (LAB) process engineer

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Familiarity with advanced process control and manufacturing best practices.
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279