Frontend(FE) CPIE (Central Product Integration Engg) HPM Integration Senior Manager/Manager

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

A leading semiconductor company is seeking a Frontend Central Product Integration Engineering Senior Manager in Singapore. The successful candidate will drive yield improvement and quality for High Bandwidth Memory products, ensuring collaboration across global teams. The role demands a minimum of 2 years of experience in Process Integration or Yield Enhancement within wafer fabrication. Offers a chance to lead a team, develop next-generation skills, and travel as necessary. Competitive compensation and growth opportunities await.

Qualifications

• At least 2 years experience in Process Integration, Yield Enhancement, or Process & Equipment Management.
• Experience with High Bandwidth Memory (HBM) products or advanced packaging preferred.
• Willingness to travel as needed for department goals.

Responsibilities

• Provide leadership for HBM product yield, quality improvement, and new product introduction.
• Work with key business partners to develop strategic tools and methodologies.
• Conduct ongoing metrics reviews to ensure achievement of performance goals.

Skills

Leadership

Process Integration

Yield Management

Communication Skills

Training Development

Job description

Overview

Frontend(FE) Central Product Integration Engineering (CPIE) HPM (High Performance Memory) Process Integration Senior Manager/Manager

As FE CPIE (Central Product Integration Engineering) HBM (High Bandwidth Memory) Integration Senior Manager at Micron Technology, Inc.,

You will be responsible for providing leadership to the global Micron network to drive HBM product cummulative yield, quality improvement, new product introduction (NPI), with the primary focus on the FE (FrontEnd) and advance packaging unique challenges on HBM products.

This team will play a crucial role in ensuring seamless collaboration for FE team with Advance Packaging Process teams, focusing on improving assembly yield and product quality. This position involves developing and disseminating Best-Known-Methods (BKMs) to our facilities in Japan, Taiwan, and the US, driving product maturity within a defined schedule while maintaining the highest standards of quality.

Responsibilities and Tasks

STRATEGIC LEADERSHIP

• Work with FAB to aim for best-in-class (BIC) Yield ramping.
• Work with key business partners to develop strategic Process Integration tools, systems, methodologies, capabilities and roadmaps. Ensure such support and roadmaps meet business expectations to enable achievement of strategic objectives and Micron’s business plan.
• Create an environment with your group that encourages innovation and technical leadership.

TACTICAL LEADERSHIP

• Conduct ongoing metrics reviews of critical group deliverables to business. Ensure work reviews are conducted on all programs, projects and critical activities to ensure achievement of committed performance. Establish structure for subordinate manager to conduct such reviews within their teams. Ensure such reviews are aligned and effective.
• Provide direct leadership on most critical group deliverables and called out performance items to ensure barriers are removed and correct resources are applied. Ensure timely and transparent communication with business partners if performance issues will risk business objectives.
• Provide periodical one-on-one sessions to review progress to the Work Plan and adjust training and performance goals.

PERFORMANCE MANAGEMENT

• Ensure clear direction, performance goals, job profiles and job expectations are established for all Team Members.
• Partner with Team Members on establishing ambitious but achievable goals. Maintain a balance between task-related goals versus results-driven goals.
• Drive accountability through clear communication, informal feedback, effective project management, and appropriate usage of metrics.

COMMUNICATION

• Provide regular and structured communications to your team, including progress toward strategic objectives, Operations goals, priority projects, and company status. Ensure Team Members are well-engaged and motivated to achieve group and company objectives. Ensure subordinate managers communicate consistently and in alignment with your regular communications.
• Ensure structured communications with Team Members provide proper motivation and optimism toward achieving Process Integration Engineering vision and mission.
• Develop external relationships to achieve new ideas and procedures to keep pace with industry standards and methods.

TRAINING AND CAREER DEVELOPMENT

• Ensure the group’s training roadmap is maintained. Focus on developing leading-edge skills and preventing isolated abilities that risk business continuity.
• Ensure leaders set specific training plans, performance goals and development activities for their Team Members.
• Develop potential successors within your group and coach/mentor to develop skills.

Requirements

At least 2 years experience as Process Integration (PI)/ Yield Enhancement(YE)/ Process & Equipment(PEE) Managers in Wafer Fabrication Field

Experience on High Band Width Memory (HBM product or advanced packaging will be a plus to this job position.

Travel Required: Yes. Willing to travel as needed to support department goals

Travel Frequency: 20-50%.