Associate Engineer Equipment Development

UTAC HEADQUARTERS PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading technology firm in Singapore is looking for a skilled professional to lead the setup and buy-off of new manufacturing processes and machines. The ideal candidate has a Diploma in Material Science, Applied Physics, or Mechanical Engineering and at least 3 years of experience in high-volume electronics manufacturing, preferably in semiconductor assembly. Responsibilities include troubleshooting machine issues and performing data analysis to ensure operational efficiency.

Qualifications

• Minimum Diploma in relevant field.
• 3+ years experience in assembly processes.
• Familiarity with high volume electronics manufacturing.

Responsibilities

• Lead setup and buy-off of new processes and machines.
• Perform execution of characterization activities.
• Troubleshoot machine-related issues for smooth operations.

Skills

Hands-on experience with SMT

Data analysis with JMP

Troubleshooting machine-related issues

Experience in semiconductor assembly

Education

Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline

Job description

Job Description

This role is fully hands-on and includes, but no limited to the following responsibilities:

• Lead the setup and buy-off of new processes and machines.
• Perform process setup, buy-off and execution of characterization activities, including DOE, prototype, qualification and mass production build.
• Trouble shoot and resolve machine-related issues to ensure smooth operations problem.
• Perform data collection, analysis and consolidation to support engineering activities.

Requirement

• Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline.
• Experience in high volume electronics manufacturing environment preferably semiconductor assembly.
• Must be familiar and have hands-on experience with either one of the following process and machines, (i) SMT/ Flux Clean, (ii) Flip Chip/ TCB, (iii) Underfill, (iv) Lid Attach/ Laser Mark, (v) Ball Mount/ AOI.
• Familiar with JMP data analysis capability.
• Knowledge and experience on multiple process of the above will be an advantage.
• Proven experience in assembly FOL/ EOL process (at least 3 years' experience).