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An innovative start-up in Cagliari is seeking an Advanced Packaging Engineer to lead device packaging projects and develop 2.5/3D solutions. This role includes managing a packaging team and collaborating with OSATs to ensure quality and reliability. Candidates should have strong semiconductor packaging expertise and excellent communication skills. This position offers the flexibility to work remotely.
Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.
The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.
This position can be worked remotely.
Please contact Rachel Anderson for further details.