International jobs in Alemania

You will be responsible for the development of SiC dicing and thin-film processes as well as for carrying out project-related tasks

Within your area of responsibility, you will lead the development of the manufacturing process for SiC power components, ensuring timely solutions to quality issues and smooth operations during the ramp-up, pre-production, and production phases

Monitoring and tracking engineering processes, as well as deriving appropriate corrective actions, will be your responsibility. This also includes analyzing and summarizing process data from engineering batches and addressing relevant technical issues

You will become an expert in reliability requirements/assessments and testing methods in your field

Your daily focus will be on improving product yield and tackling major challenges

Successfully completed studies in semiconductor physics, microelectronics, materials science, chemistry, or a comparable field within the semiconductor industry

At least 10 years of experience in the introduction or development of dicing and thin-film processes for semiconductors

Practical experience in the introduction or production of SiC products in fabs is required

You are proficient in measurement methods and techniques for evaluating materials and process results

Ideally, you are already familiar with the SiC process flow, the manufacturing process, and characterization techniques and have extensive expertise in semiconductor material processing, preferably in the development of power components

Good knowledge in the field of mass production of semiconductor technology is advantageous

Your hands-on mentality and open attitude towards intercultural work environments make it easy for you to quickly adapt to new environments

In addition to excellent communication and presentation skills in English, knowledge of German and/or Chinese is also advantageous

Flexibility and openness to international business trips or delegations complete your profile