Microelectronic Packaging Design Engineer - (104438)

Sanmina; Ottawa; On-site; CAD 90,000 - 120,000; Full time

Job summary

A leading technology company in Ottawa is seeking a Microelectronic Packaging Design Engineer to join its team. The ideal candidate will have over 8 years of experience in electronic hardware design, specifically in microelectronic packaging for RF and optical applications. Strong communication and customer delivery focus are essential. This flexible role involves working on innovative product development and requires proficiency in design software. Competitive compensation is offered.

Qualifications

• 8+ years of relevant experience in microelectronic design.
• Background in semiconductor packaging for RF/Microwave/Optical applications.
• Familiarity with commercial FEA tools.

Responsibilities

• Select microelectronic technologies and define design concepts.
• Design microelectronic packages & modules for manufacturing.
• Generate product documentation including design specifications.
• Perform engineering product verification to ensure compliance.

Skills

Experience in electronic hardware design

Proficient with CadenceAllegroPackage Designer Plus

Strong communication skills

Customer delivery focused

Education

Bachelor’s Degree in Mechanical Engineering, Physics, or Material Science

Tools

CadenceAllegroPackage Designer Plus

Job description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities

• Select microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications.
• Design microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
• Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
• Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
• Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
• Perform and support engineering product verification, ensuring compliance to product requirements.
• Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
• Support turnkey product development process through to manufacturing implementation.

Education and Experience

• Bachelor’s Degree in Mechanical Engineering, Physics, Material Science, or other relevant degree with experience in electronic hardware design and packaging including multi‑chip modules and semiconductor packaging for RF/Microwave/Optical applications.
• Minimum of 8 years’ of relevant experience.
• Proficient with packaging and substrate design software (CadenceAllegroPackage Designer Plus).
• Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
• Experience in end‑to‑end product development and manufacturing implementation.
• Familiar with commercial FEA tools and supporting analysis.
• Security clearance is an asset.
• Must be customer delivery focused, have strong communication skills, and be able to work well within a multidisciplinary product development team in a fast‑paced and challenging environment.

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.