Senior Tech PM - Multi‑Die Packaging & AI

Synopsys; Mountain View (CA); On-site; USD 180,000 - 250,000; Full time

Job summary

Synopsys in Mountain View, CA seeks a Senior Technical Product Leader for multi-die advanced packaging. You will drive the tech roadmap, engage with customers, foundries, and OSATs, and translate packaging challenges into prioritized requirements while shaping next-generation SI/PI and thermal/m mechanical analysis flows.

This role demands deep engineering depth in 2.5D/3DIC, chiplet architectures, and AI-driven design automation to guide roadmaps and validate solutions across silicon, package,

Qualifications

• Extensive experience in semiconductor IC and packaging.
• Hands-on with packaging design tools and SI/PI analysis.
• Experience with 2.5D/3DIC, chiplet, HBM, photonics, and co-packaged optics.

Responsibilities

• Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
• Translate packaging challenges into prioritized requirements with customers and partners.
• Guide roadmap priorities and validate solutions against packaging problems.
• Define capabilities with engineering teams and validate solutions across silicon, package, and substrate.
• Drive cross-functional delivery addressing package implementation and multiphysics challenges.
• Advance AI-driven workflows for multi-die design and optimization.
• Present technical vision to executives and ecosystem partners.
• Provide technical direction to field teams.

Skills

Semiconductor packaging

IC packaging design

SI/PI analysis

2.5D/3DIC

AI-driven workflows

Job description

Synopsys in Mountain View, CA seeks a Senior Technical Product Leader for multi-die advanced packaging. You will drive the tech roadmap, engage with customers, foundries, and OSATs, and translate packaging challenges into prioritized requirements while shaping next-generation SI/PI and thermal/m mechanical analysis flows.

This role demands deep engineering depth in 2.5D/3DIC, chiplet architectures, and AI-driven design automation to guide roadmaps and validate solutions across silicon, package,