Senior Architect, Advanced Packaging & 3DIC Systems

Synopsys, Inc.; Northern (KY); Hybrid; USD 180,000 - 280,000; Full time

Benefits offered by this job

Health benefits

Financial rewards

Job summary

Synopsys, Inc. is seeking a Distinguished Engineer to lead advanced packaging solutions within the 3DIC Compiler platform.

You will architect and drive substrate design automation for multi-die systems, delivering production-grade algorithms for HDI routing, power delivery, and manufacturability, while shaping product strategy with customers and R&D. You will mentor engineers, elevate algorithmic rigor, and influence the architecture of a strategic Synopsys growth area focused on AI, HPC, and

Qualifications

• Deep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.
• Proven experience building production software products at scale.
• Strong algorithmic foundation for physical design automation challenges.
• Track record of technical leadership through architecture ownership, product influence, publications, or patents.

Responsibilities

• Architect and drive package substrate design automation capabilities within the 3DIC Compiler platform.
• Design and implement production-grade algorithms for HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.
• Build scalable C/C++ software for advanced packaging designs, including multi-die chiplets and heterogeneous integration.
• Partner with customers, product teams, and R&D to translate design bottlenecks into durable technical solutions.
• Lead architecture reviews and influence technical decisions across the 3DIC product portfolio.
• Mentor engineers and raise the bar on algorithmic rigor, performance, and software quality.

Skills

Advanced packaging

Package substrate design

C/C++ programming

Production software

Architecture ownership

Leadership

Education

Advanced degree in CS/EE

Tools

C/C++

HDI auto-routing

Design rule checking

Job description

Synopsys, Inc. is seeking a Distinguished Engineer to lead advanced packaging solutions within the 3DIC Compiler platform.

You will architect and drive substrate design automation for multi-die systems, delivering production-grade algorithms for HDI routing, power delivery, and manufacturability, while shaping product strategy with customers and R&D. You will mentor engineers, elevate algorithmic rigor, and influence the architecture of a strategic Synopsys growth area focused on AI, HPC, and