Senior Technical PM & 3DIC Packaging Architect

Synopsys; Austin (TX); On-site; USD 195,000 - 292,000; Full time

Benefits offered by this job

Annual bonus

Equity

Comprehensive health benefits

Job summary

Synopsys in Austin, Texas seeks a Senior Architect, Technical Product Manager for 3DIC packaging to lead roadmap and signoff analyses across multi-die architectures. You will collaborate with design and manufacturing teams to translate complex packaging challenges into clear requirements and prioritized roadmaps.

The role requires deep depth in IC packaging, SI/PI, and high-speed interfaces, with a focus on AI-driven workflows and production-ready solutions.

Qualifications

• 10+ years of semiconductor IC and packaging experience.
• Deep technical knowledge of IC and package design, analysis, manufacturing, and production tapeout.
• Hands-on expertise with industry-standard silicon and package design tools, SI/PI analysis tools, and related production flows.
• Expertise in signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.
• Experience with 2.5D/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures/methodologies.
• Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of packagedesign & signoff.
• Understanding of AI-driven and agentic workflows for design automation, analysis, and optimization.
• Experience working with semiconductor companies, hyperscalers, foundries, OSATs, and ecosystem partners.
• Demonstrated ability to translate complex technical challenges into requirements and roadmap priorities.

Responsibilities

• Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
• Engage with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements.
• Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings with technical clarity.
• Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, and validate solutions across silicon, advanced package, and package substrate flows.
• Drive cross-functional delivery of solutions addressing package implementation, SI/PI, multiphysics, and manufacturing challenges.
• Advance AI-driven and agentic workflows for multi-die design, multiphysics analysis, and optimization.
• Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events and standards engagements.
• Provide technical direction to field teams supporting customer evaluations and deployments.

Skills

IC packaging

Package analysis

Signal integrity

Power integrity

Thermal analysis

Mechanical analysis

2.5D/3DIC

Chiplet

HBM

PCIe/DDR interf.

Tools

SI/PI tools

Job description

Synopsys in Austin, Texas seeks a Senior Architect, Technical Product Manager for 3DIC packaging to lead roadmap and signoff analyses across multi-die architectures. You will collaborate with design and manufacturing teams to translate complex packaging challenges into clear requirements and prioritized roadmaps.

The role requires deep depth in IC packaging, SI/PI, and high-speed interfaces, with a focus on AI-driven workflows and production-ready solutions.