Senior Architect, Advanced Packaging & 3DIC Systems

Synopsys Inc; United States; On-site; USD 210,000 - 280,000; Full time

Job summary

Synopsys Inc. in the United States seeks a Distinguished Engineer to lead package substrate design automation within the 3DIC Compiler for multi-die systems powering AI and HPC applications.

You will own architecture, mentor engineers, and drive scalable C/C++ software while collaborating with customers and product teams to translate design bottlenecks into durable technical solutions. This role emphasizes systems thinking across substrate architecture, connectivity, SI/PI, and manufacturability.

Qualifications

• Deep expertise in advanced packaging, substrate design, routing, power delivery, and manufacturability.
• Proven experience building production software products at scale.
• Strong algorithmic foundation for physical design automation challenges.
• Expert-level C/C++ skills for performance-critical, large-scale systems.

Responsibilities

• Architect and drive package substrate design automation within the 3DIC Compiler platform.
• Design and implement production-grade algorithms for HDI substrate auto-routing, DAC, power integrity, and manufacturability.

Skills

C/C++

Advanced packaging

Algorithm design

Production software

Architecture ownership

Education

Advanced degree in Computer Science or Electrical Engineering

Job description

Synopsys Inc. in the United States seeks a Distinguished Engineer to lead package substrate design automation within the 3DIC Compiler for multi-die systems powering AI and HPC applications.

You will own architecture, mentor engineers, and drive scalable C/C++ software while collaborating with customers and product teams to translate design bottlenecks into durable technical solutions. This role emphasizes systems thinking across substrate architecture, connectivity, SI/PI, and manufacturability.