Senior 3D/2.5D Packaging Engineer for AI Chips

Broadcom Inc.; Irvine (CA); On-site; USD 122,000 - 203,000; Full time

Job summary

Broadcom Inc. in Irvine, California, seeks a seasoned packaging technology professional to develop and enable advanced packaging to integrate memory dies and SoC dies for AI-related products. You will lead roadmap, support HBM/iVR/SiCap components, manage reliability testing, and drive yield improvements.

The role demands extensive 2.5D/3D packaging experience, strong PM skills, and a drive for technology innovation. Competitive compensation and comprehensive benefits are offered.

Qualifications

• 10+ years of post-degree experience in 2.5D/3D packaging or HBM tech.
• Strong project management and teamwork skills.
• Proven ability in technology innovation and enablement.
• MS in Engineering; PhD reduces required experience to 7 years.

Responsibilities

• Develop a packaging technology roadmap for 3–5 years.
• Support development of HBM, iVR, SiCap components.
• Manage reliability testing for new technology.
• Lead yield improvement during technology ramp.

Skills

2.5D/3D packaging

HBM tech development

Reliability improvements

Project management

Teamwork

Innovation

Education

MS in Engineering

Job description

Broadcom Inc. in Irvine, California, seeks a seasoned packaging technology professional to develop and enable advanced packaging to integrate memory dies and SoC dies for AI-related products. You will lead roadmap, support HBM/iVR/SiCap components, manage reliability testing, and drive yield improvements.

The role demands extensive 2.5D/3D packaging experience, strong PM skills, and a drive for technology innovation. Competitive compensation and comprehensive benefits are offered.