Technical Product Management, Sr Architect

Synopsys; Austin (TX); On-site; USD 195,000 - 292,000; Full time

Benefits offered by this job

Annual bonus

Equity

Comprehensive health benefits

Job summary

Synopsys in Austin, Texas seeks a Senior Architect, Technical Product Manager for 3DIC packaging to lead roadmap and signoff analyses across multi-die architectures. You will collaborate with design and manufacturing teams to translate complex packaging challenges into clear requirements and prioritized roadmaps.

The role requires deep depth in IC packaging, SI/PI, and high-speed interfaces, with a focus on AI-driven workflows and production-ready solutions.

Qualifications

• 10+ years of semiconductor IC and packaging experience.
• Deep technical knowledge of IC and package design, analysis, manufacturing, and production tapeout.
• Hands-on expertise with industry-standard silicon and package design tools, SI/PI analysis tools, and related production flows.
• Expertise in signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.
• Experience with 2.5D/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures/methodologies.
• Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of packagedesign & signoff.
• Understanding of AI-driven and agentic workflows for design automation, analysis, and optimization.
• Experience working with semiconductor companies, hyperscalers, foundries, OSATs, and ecosystem partners.
• Demonstrated ability to translate complex technical challenges into requirements and roadmap priorities.

Responsibilities

• Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
• Engage with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements.
• Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings with technical clarity.
• Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, and validate solutions across silicon, advanced package, and package substrate flows.
• Drive cross-functional delivery of solutions addressing package implementation, SI/PI, multiphysics, and manufacturing challenges.
• Advance AI-driven and agentic workflows for multi-die design, multiphysics analysis, and optimization.
• Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events and standards engagements.
• Provide technical direction to field teams supporting customer evaluations and deployments.

Skills

IC packaging

Package analysis

Signal integrity

Power integrity

Thermal analysis

Mechanical analysis

2.5D/3DIC

Chiplet

HBM

PCIe/DDR interf.

Tools

SI/PI tools

Job description

Sr Architect, Technical Product Manager (3DIC Packaging)

Job ID

18502

City

Austin

State/Province

Texas

Date Posted

27-Aug-2026

Job Category

Product Management

Job Subcategory

Technical Product Management

Employee

Yes

Base Salary Range: $195000 - $ 292000

Descriptions & Requirements

Job Description and Requirements

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with customers across industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You are a senior technical product leader with hands-on experience in IC packaging design, package analysis, and production tapeout flows. You have worked directly with multi-die and package layout tools, and SI/PI, thermal and mechanical analysis flows.

You understand 2.5/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures and can engage credibly with architects, silicon and package engineering teams, foundries, OSATs, and ecosystem partners.

This Technical Product Management role requires substantial engineering depth. Success depends on understanding the technology, design flows, and implementation challenges well enough to guide roadmap priorities, define detailed requirements, and validate solutions against real packaging problems.

What You’ll Be Doing

• Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
• Engage with customers, foundries, and OSATs to translatepackaging challenges into prioritizedrequirements.
• Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings with technical clarity.
• Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, andvalidatesolutions across silicon, advanced package, and package substrate flows.
• Drive cross-functional delivery of solutions addressing package implementation, SI/PI, multiphysics ,and manufacturing challenges.
• Advance AI-driven and agentic workflows for multi-die design, multiphysics analysis, and optimization.
• Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events and standards engagements.
• Provide technical direction tofield teams supporting customer evaluations and deployments.

The Impact You Will Have

• Enable next-generation AI accelerators, high-performance computing, and data-center silicon built on advanced multi-die architectures.
• Expand Synopsys’multi-diepackaging presence through differentiated package design, multiphysics analysis, and production solutions.
• Drive adoption across semiconductor companies, hyperscalers ,and design service providers by aligning product capabilities with production tapeout requirements.
• Strengthen foundryand OSATpartnerships through technical roadmap alignment and co-development.
• Enable customers to scale multi-die advanced packages by addressing complex implementation, SI/PI, thermal, mechanical, and system integration challenges.

What You’ll Need

• 10+ years of semiconductor IC and packaging experience.
• Deep technical knowledge of ICand packagedesign, analysis, manufacturing, and production tapeout .
• Hands-onexpertisewith industry-standardsilicon and packagedesign tools, SI/PI analysis tools, and related production flows.
• Expertisein signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.
• Experience with2.5D/3DIC,chiplet, HBM, photonics, and co-packaged optics architectures&methodologies.
• Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of packagedesign & signoff.
• Understanding of AI-driven and agentic workflows for design automation,analysis, and optimization.
• Experience working with semiconductor companies, hyperscalers , foundries, OSATs, and ecosystem partners.
• Demonstrated ability to translate complex technical challenges intorequirements and roadmap priorities.

At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.

In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.