Senior Architect, Advanced Packaging (3DIC, Remote)
Synopsys
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Benefits offered by this job
Job summary
Synopsys is seeking a Distinguished Engineer for Advanced Packaging Solutions in Mountain View, CA. You will architect and drive package substrate design automation within the 3DIC Compiler platform, building scalable C/C++ software for multi-die chiplets and heterogeneous integration.
Lead architecture reviews, mentor engineers, and partner with customers to translate bottlenecks into durable technical solutions, shaping next-generation AI and HPC packaging capabilities.
Qualifications
- Deep expertise in advanced packaging or package substrate design, routing, power delivery, and manufacturability.
- Proven experience building production software products at scale.
- Strong algorithmic foundation for physical design automation challenges.
Responsibilities
- Architect and drive package substrate design automation within the 3DIC Compiler platform.
- Design and implement production-grade algorithms for HDI substrate auto-routing, DRC, power delivery and manufacturability.
- Build scalable C/C++ software for multi-die chiplets and heterogeneous integration.
- Mentor engineers and influence technical decisions across the 3DIC product portfolio.
- Collaborate with customers, product teams, and R&D to translate bottlenecks into durable solutions.
Skills
Education
Job description
Synopsys is seeking a Distinguished Engineer for Advanced Packaging Solutions in Mountain View, CA. You will architect and drive package substrate design automation within the 3DIC Compiler platform, building scalable C/C++ software for multi-die chiplets and heterogeneous integration.
Lead architecture reviews, mentor engineers, and partner with customers to translate bottlenecks into durable technical solutions, shaping next-generation AI and HPC packaging capabilities.
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