Senior Technical PM - Multi-Die Packaging & AI

Synopsys, Inc.; Northern (KY); Hybrid; USD 180,000 - 270,000; Full time

Job summary

Synopsys, Inc. is seeking a senior technical product leader with deep IC packaging experience to guide multi-die packaging roadmaps and signoff analysis.

You will collaborate with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements and drive AI-driven workflows across silicon, advanced package, and substrate flows. You will work with engineering teams to define capabilities, evaluate tradeoffs, and validate solutions, while presenting the technical

Qualifications

• 15+ years in semiconductor IC packaging, design, analysis and production tapeout.
• Hands-on expertise with industry-standard silicon and package design tools.
• Experience with SI/PI, thermal and mechanical analyses for advanced packages.
• Familiarity with 2.5D/3DIC, chiplet, HBM, photonics and co-packaged optics.
• Knowledge of PCIe, DDR, and HBM interfaces in packaging context.
• Ability to translate complex challenges into clear requirements and roadmap priorities.
• Experience collaborating with foundries, OSATs and ecosystem partners.

Responsibilities

• Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.
• Engage with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements.
• Evaluate the competitive landscape and emerging technologies to guide roadmap priorities.
• Work hands-on with engineering teams to define capabilities and validate solutions across flows.
• Drive cross-functional delivery addressing package implementation, SI/PI, multiphysics, and manufacturing challenges.
• Advance AI-driven workflows for multi-die design, multiphysics analysis, and optimization.
• Present the technical vision and roadmap to executives, customers, and ecosystem partners.
• Provide technical direction to field teams supporting evaluations and deployments.

Skills

IC packaging design

Package analysis

Production tapeout flows

Multi-die architectures

2.5D/3DIC

Chiplet

HBM

AI-driven workflows

Roadmap development

Job description

Synopsys, Inc. is seeking a senior technical product leader with deep IC packaging experience to guide multi-die packaging roadmaps and signoff analysis.

You will collaborate with customers, foundries, and OSATs to translate packaging challenges into prioritized requirements and drive AI-driven workflows across silicon, advanced package, and substrate flows. You will work with engineering teams to define capabilities, evaluate tradeoffs, and validate solutions, while presenting the technical