Senior SoC Packaging Substrate Engineer, Roadmap Focus

Apple Inc.; Austin (TX); On-site; USD 150,000 - 210,000; Full time

Job summary

Apple Inc. is seeking a seasoned Substrate Packaging Engineer to lead SoC package substrate technology development and roadmap definition. You will collaborate with foundries, OSATs, and cross-functional teams to bring substrate solutions from concept to high-volume manufacturing.

The role requires hands-on experience in substrate manufacturing, strong project management skills, and familiarity with Cadence Allegro. A BS with extensive experience is essential, with advanced degrees preferred.

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or Ph.D. and 8+ years of relevant industry experience.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.

Responsibilities

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Collaborate with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.

Skills

Substrate technology

Project management

Education

Bachelor's degree in a relevant field

Master's degree or Ph.D.

Tools

Cadence Allegro

Job description

Apple Inc. is seeking a seasoned Substrate Packaging Engineer to lead SoC package substrate technology development and roadmap definition. You will collaborate with foundries, OSATs, and cross-functional teams to bring substrate solutions from concept to high-volume manufacturing.

The role requires hands-on experience in substrate manufacturing, strong project management skills, and familiarity with Cadence Allegro. A BS with extensive experience is essential, with advanced degrees preferred.