Substrate Technology Lead: Packaging & Innovation

Apple, Inc.; Irvine (CA); On-site; USD 129,000 - 225,000; Full time

Benefits offered by this job

Medical and dental coverage

Retirement benefits

Stock programs

Tuition reimbursement

Relocation support

Job summary

Apple is seeking a senior hardware packaging engineer to own and drive sophisticated package substrate development, roadmaps, and architecture optimization. You will coordinate with substrate manufacturers, foundries, and OSAT partners to bring solutions from concept to high-volume manufacturing.

Ideal candidates bring MS/PhD level fundamentals in materials or mechanical engineering, hands-on substrate manufacturing experience, and proficiency with Cadence Allegro for design reviews and

Qualifications

• Bachelor's degree required.
• MS or Ph.D. preferred in a related field.
• Foundational knowledge in substrate technology, materials or mechanical engineering.
• Hands-on substrate manufacturing and technology development experience.
• Knowledge of Cu plating, lithography, dielectric materials and laser via formation.
• Familiarity with package assembly and integration processes.
• Experience with Cadence Allegro tools and DFM reviews.

Responsibilities

• Lead RFSIP package substrate development and roadmap definition.
• Collaborate with substrate manufacturers, foundries and OSAT partners.
• Work with cross-functional groups from concept to high-volume manufacturing.
• Drive advanced package solutions and new materials development.
• Travel internationally up to 5% of time.

Skills

Substrate technology

Cu plating

Lithography

Dielectric material

Laser via formation

Solder resist

Package assembly

Project management

Education

Bachelor's degree

MS or Ph.D.

Tools

Cadence Allegro

Job description

Apple is seeking a senior hardware packaging engineer to own and drive sophisticated package substrate development, roadmaps, and architecture optimization. You will coordinate with substrate manufacturers, foundries, and OSAT partners to bring solutions from concept to high-volume manufacturing.

Ideal candidates bring MS/PhD level fundamentals in materials or mechanical engineering, hands-on substrate manufacturing experience, and proficiency with Cadence Allegro for design reviews and