Lead Substrate Technologist, Packaging & Roadmaps

Apple, Inc.; United States; Remote; USD 129,000 - 225,000; Full time

Benefits offered by this job

Comprehensive medical and dental

Employee stock programs

Relocation eligibility

Tuition reimbursement

Job summary

Apple, Inc. in the San Francisco Bay Area is seeking a substrate packaging expert to own the package substrate development from concept to high-volume manufacturing.

You will drive roadmap definition and work with suppliers across the supply chain to optimize performance, cost, and availability. The role requires a Bachelor's degree (MS/PhD preferred) with strong fundamentals in materials or mechanical engineering and hands-on substrate manufacturing experience, including Cu plating and

Qualifications

• Bachelor's degree required.
• MS or PhD and relevant industry experience preferred.
• Strong fundamentals in material/chemistry or mechanical engineering.

Responsibilities

• Lead RFSIP package substrate development and roadmap.
• Collaborate with substrate manufacturing, foundry, and OSAT to move concepts to high-volume manufacture.
• Work with cross-functional groups on architectures optimizing performance, risk, cost and availability.

Skills

Substrate technology

Cadence Allegro

Project management

Cross-functional collaboration

Education

Bachelor's degree

MS or PhD in related field

Tools

Cadence Allegro platform tools

Job description

Apple, Inc. in the San Francisco Bay Area is seeking a substrate packaging expert to own the package substrate development from concept to high-volume manufacturing.

You will drive roadmap definition and work with suppliers across the supply chain to optimize performance, cost, and availability. The role requires a Bachelor's degree (MS/PhD preferred) with strong fundamentals in materials or mechanical engineering and hands-on substrate manufacturing experience, including Cu plating and