Packaging Substrate Engineer

Apple; United States; On-site; USD 180,000 - 260,000; Full time

Job summary

Apple is seeking a senior leader for its Hardware Technology Packaging team to own the package substrate strategy, design optimization, and roadmap for internal and external components of its consumer devices. You will collaborate with cross-functional teams and external foundries to drive advanced substrate solutions from concept to high-volume manufacturing.

The role requires deep expertise in substrate technology, manufacturing processes, and DFM, with hands-on experience in Cu plating,

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or Ph.D. and 8+ years of relevant industry experience.
• Familiarity with substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish.

Responsibilities

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.

Skills

Leadership

Communication

Project management

Team collaboration

Problem solving

Education

BS degree in relevant field

MS or PhD preferred

Tools

Cadence Allegro

DFM (Design for Manufacturing)

Cu plating

Lithography

Dielectric material

Via formation

Solder resist

Job description

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.

Minimum Qualifications

BS and 10+ years of relevant industry experience.

Preferred Qualifications

MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.