Lead Substrate Technologist - Packaging & Tech Strategy

Apple Inc.; San Diego (CA); Hybrid; USD 175.000 - 309.000; Vollzeit

Benefits dieser Stelle

Employee stock purchase plan

Discretionary bonuses or commission

Relocation assistance

Zusammenfassung

Apple Inc. is seeking a senior professional to own and drive sophisticated package substrate development, architecture optimization, and roadmap definition for Apple's hardware packaging programs.

This role collaborates with foundries, OSATs, and cross-functional teams to advance technology from concept through high-volume manufacturing. Responsibilities include leading substrate technology development, managing risks and costs, and ensuring packaging solutions meet performance targets.

Qualifikationen

• BS in engineering or related field and 10+ years of substrate industry experience.
• Experience in substrate manufacturing and technology development.
• Strong fundamentals in materials/chemistry or mechanical engineering.

Aufgaben

• Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Work across cross-functional groups to define & optimize new package substrate architectures based on performance, risk, cost, and availability.
• Drive industry with sophisticated package solutions, new materials development, and specs.

Kenntnisse

Substrate technology

Package design

Cu plating

Lithography

Dielectric materials

Laser via formation

Solder resist

Cadence Allegro

DFM

Project management

Ausbildung

BS in engineering or related field

MS or PhD (preferred)

Tools

Cadence Allegro

DFM tooling

Jobbeschreibung

Apple Inc. is seeking a senior professional to own and drive sophisticated package substrate development, architecture optimization, and roadmap definition for Apple's hardware packaging programs.

This role collaborates with foundries, OSATs, and cross-functional teams to advance technology from concept through high-volume manufacturing. Responsibilities include leading substrate technology development, managing risks and costs, and ensuring packaging solutions meet performance targets.