Lead SoC Packaging Substrate Engineer

Apple; United States; In loco; USD 180.000 - 260.000; Tempo pieno

Descrizione del lavoro

Apple is seeking a senior leader for its Hardware Technology Packaging team to own the package substrate strategy, design optimization, and roadmap for internal and external components of its consumer devices. You will collaborate with cross-functional teams and external foundries to drive advanced substrate solutions from concept to high-volume manufacturing.

The role requires deep expertise in substrate technology, manufacturing processes, and DFM, with hands-on experience in Cu plating,

Competenze

• BS and 10+ years of relevant industry experience.
• MS or Ph.D. and 8+ years of relevant industry experience.
• Familiarity with substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish.

Mansioni

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.

Conoscenze

Leadership

Communication

Project management

Team collaboration

Problem solving

Formazione

BS degree in relevant field

MS or PhD preferred

Strumenti

Cadence Allegro

DFM (Design for Manufacturing)

Cu plating

Lithography

Dielectric material

Via formation

Solder resist

Descrizione del lavoro

Apple is seeking a senior leader for its Hardware Technology Packaging team to own the package substrate strategy, design optimization, and roadmap for internal and external components of its consumer devices. You will collaborate with cross-functional teams and external foundries to drive advanced substrate solutions from concept to high-volume manufacturing.

The role requires deep expertise in substrate technology, manufacturing processes, and DFM, with hands-on experience in Cu plating,