Packaging Substrate Engineer

Apple Inc.; Austin (TX); On-site; USD 150,000 - 210,000; Full time

Job summary

Apple Inc. is seeking a seasoned Substrate Packaging Engineer to lead SoC package substrate technology development and roadmap definition. You will collaborate with foundries, OSATs, and cross-functional teams to bring substrate solutions from concept to high-volume manufacturing.

The role requires hands-on experience in substrate manufacturing, strong project management skills, and familiarity with Cadence Allegro. A BS with extensive experience is essential, with advanced degrees preferred.

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or Ph.D. and 8+ years of relevant industry experience.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.

Responsibilities

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Collaborate with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.

Skills

Substrate technology

Project management

Education

Bachelor's degree in a relevant field

Master's degree or Ph.D.

Tools

Cadence Allegro

Job description

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

Description

• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.

Responsibilities

• Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
• Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.
• Problem solving of technical issues during the full product development cycle.

Minimum Qualifications

• BS and 10+ years of relevant industry experience.

Preferred Qualifications

• MS or Ph.D. and 8+ years of relevant industry experience.
• Proven fundamentals in material/chemistry/mechanical engineering field(s).
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
• Familiarity with package assembly and integration process preferred.
• Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
• Exceptional technology development & project management skills.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

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Apple accepts applications to this posting on an ongoing basis.