Senior SoC Packaging Substrate Engineer

Apple, Inc.; Austin (TX); Presencial; USD 170.000 - 230.000; Jornada completa

Descripción de la vacante

Apple, Inc. is seeking an experienced packaging engineer to lead SoC substrate technology development for our hardware roadmap.

You will own package substrate design, technology development, and collaboration across manufacturing and supplier partners to optimize performance, cost, and yield. You will work with cross-functional teams to define architectures, drive material and process development, and support transition from concept to high-volume manufacturing, with occasional international

Formación

• BS with 10+ years of relevant industry experience.
• MS or Ph.D. with 8+ years of experience.
• Strong fundamentals in materials/chemistry/mechanical engineering.
• In-depth knowledge of substrate technology, manufacturing, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish.
• Familiarity with package assembly and integration process.
• Experience in Cadence Allegro platform tools and DFM review.
• Exceptional technology development and project management skills.

Responsabilidades

• Lead substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
• Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
• Work with cross-functional groups to define and optimize new package substrate architectures based on performance, risk, cost, and availability.
• Problem solving of technical issues during the full product development cycle.

Conocimientos

Package technology

Project management

Cadence Allegro

Cross-functional collaboration

Problem solving

Educación

BS in a relevant field

Herramientas

Cadence Allegro

DFM

Descripción del empleo

Apple, Inc. is seeking an experienced packaging engineer to lead SoC substrate technology development for our hardware roadmap.

You will own package substrate design, technology development, and collaboration across manufacturing and supplier partners to optimize performance, cost, and yield. You will work with cross-functional teams to define architectures, drive material and process development, and support transition from concept to high-volume manufacturing, with occasional international