Lead Packaging Substrate Engineer - Architecture & Roadmap

Apple Inc.; United States; In loco; USD 185.000 - 325.000; Tempo pieno

Descrizione del lavoro

Apple Inc. in the San Francisco Bay Area is seeking a Senior Lead for substrate technology development within Hardware Packaging. You will own package substrate design, technology development, and roadmap alignment with cross-functional teams across manufacturing and supply chain.

The role requires hands-on experience in substrate manufacturing, advanced degrees preferred, and the ability to drive architecture, material selection, and process optimization while traveling internationally up to 5%.

Competenze

• BS with 10+ years of relevant industry experience.
• MS or PhD with 8+ years in substrate technology and packaging.

Mansioni

• Lead substrate technology development from concept to high-volume manufacturing (HVM).
• Define and optimize package substrate architectures based on performance, risk, cost, and availability.
• Drive problem solving across the full product development cycle with cross-functional teams.

Conoscenze

Project management

Technology development

Cross-functional collaboration

Formazione

BS degree

MS or PhD

Strumenti

Cadence Allegro

Descrizione del lavoro

Apple Inc. in the San Francisco Bay Area is seeking a Senior Lead for substrate technology development within Hardware Packaging. You will own package substrate design, technology development, and roadmap alignment with cross-functional teams across manufacturing and supply chain.

The role requires hands-on experience in substrate manufacturing, advanced degrees preferred, and the ability to drive architecture, material selection, and process optimization while traveling internationally up to 5%.