Lead Substrate Technologist – Packaging & Innovation

Apple Inc.; Irvine (CA); Hybrid; USD 175,000 - 309,000; Full time

Job summary

Apple Inc. is seeking a senior engineer to lead substrate package development, defining roadmaps and coordinating with foundries and OSATs to deliver high-performance package solutions for Apple products.

You will work with cross-functional teams to optimize architectures, manage risks, and address technical challenges across the entire development cycle. The role requires deep knowledge of substrate technology, manufacturing processes, and hands-on experience with Cu plating, lithography,

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or Ph.D. and 5+ years of relevant industry experience.
• Fundamentals in the material/chemistry/ or mechanical engineering field(s).
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
• Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.

Responsibilities

• Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Work across cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability.
• Problem solving of technical issues during the full product development cycle.
• 5% International travel.

Education

BS degree

MS or Ph.D. (preferred)

Tools

Cu plating

Lithography

Dielectric material

Laser via formation

Solder resist

Job description

Apple Inc. is seeking a senior engineer to lead substrate package development, defining roadmaps and coordinating with foundries and OSATs to deliver high-performance package solutions for Apple products.

You will work with cross-functional teams to optimize architectures, manage risks, and address technical challenges across the entire development cycle. The role requires deep knowledge of substrate technology, manufacturing processes, and hands-on experience with Cu plating, lithography,