Global Substrate Technologist - Packaging & Innovation

Apple, Inc.; San Diego (CA); On-site; USD 123,000 - 214,000; Full time

Job summary

Apple, Inc. is seeking a packaging substrate engineer to lead development from concept to high-volume manufacturing, shaping package architectures and roadmaps.

You will collaborate with manufacturing, design, and engineering teams to deliver substrate solutions across Apple products and external components. The role requires a Bachelor's degree with preferred MS/PhD, experience in substrate technology and manufacturing, and hands-on work in areas like Cu plating, lithography, and laser via

Qualifications

• Bachelor's degree required.
• MS or Ph.D. and relevant industry experience preferred.
• Familiar with substrate technology, manufacturing process, design rules and roadmap.
• Hands-on substrate manufacturing and technology development experience (Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist).

Responsibilities

• Develop substrate technologies from concept to high-volume manufacturing (HVM).
• Define and optimize substrate architectures based on performance, risk, cost and availability.
• Solve technical issues during full product development cycle.

Skills

Strong collaboration

Problem solving

Project management

Education

Bachelor's degree

MS or PhD

Tools

Cadence Allegro platform tools

Job description

Apple, Inc. is seeking a packaging substrate engineer to lead development from concept to high-volume manufacturing, shaping package architectures and roadmaps.

You will collaborate with manufacturing, design, and engineering teams to deliver substrate solutions across Apple products and external components. The role requires a Bachelor's degree with preferred MS/PhD, experience in substrate technology and manufacturing, and hands-on work in areas like Cu plating, lithography, and laser via