Senior Silicon Photonics Packaging Engineer (2.5D/3D)

Cisco

Carlsbad (CA)

On-site

USD 155,000 - 225,000

Full time

2 days ago

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Job summary

Cisco Systems is seeking a highly capable Advanced Packaging engineer to join Cisco's Packaging Technology & Quality team within our Global Supply Chain. You will drive advanced packaging technology development to support Cisco’s ground breaking silicon photonic technology roadmap including optical engines, co-packaged optics and on-board optics.

The role requires hands-on experience with 2.5D/3D integration, DfM and DfR, and cross-functional collaboration with OSATs, foundries and suppliers to

Qualifications

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or related field.
4+ years of advanced packaging experience with high-density integration.
Knowledge of advanced interconnect materials, processes and assembly.
Hands-on CAD experience with kLayout, APD, SolidWorks.

Responsibilities

Develop silicon photonic packaging and heterogeneous integration tech (2.5D/3D).
Drive design and analysis of packaging test vehicles and validate metrics.
Oversee wafer processing, fine pitch, hybrid bonding, fanout, substrates and assembly.
Collaborate with foundries/partners to qualify robust packaging solutions.
Guide DfM and DfR through modeling and design considerations.
Identify risks and implement corrective actions through root-cause analysis.

Skills

Advanced packaging

Cross-functional collaboration

Project execution

Education

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or related field

Tools

kLayout

APD

SolidWorks

Job description

The role requires hands-on experience with 2.5D/3D integration, DfM and DfR, and cross-functional collaboration with OSATs, foundries and suppliers to

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