Senior Photonic Packaging Engineer - SiPh & CPO HI

GlobalFoundries inc.; Essex Junction (VT); On-site; USD 132,000 - 242,000; Full time

Job summary

GlobalFoundries in the United States is seeking a senior Photonic Packaging Engineer to lead optical packaging architectures for silicon photonics and co-packaged optics. You will collaborate with photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss packaging solutions with high reliability.

The role emphasizes 2.5D/3D/3.5D heterogeneous integration, multiphysics simulations, and engagement with OSATs to ensure mass production readiness.

Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.
• 15+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Excellent analytical, problem-solving, and communication skills.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies.
• Perform multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.

Skills

English proficiency

Education

Master’s degree in Packaging, Materials Science, Mechanical Engineering

Tools

Lumerical

COMSOL

Job description

GlobalFoundries in the United States is seeking a senior Photonic Packaging Engineer to lead optical packaging architectures for silicon photonics and co-packaged optics. You will collaborate with photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low‑loss packaging solutions with high reliability.

The role emphasizes 2.5D/3D/3.5D heterogeneous integration, multiphysics simulations, and engagement with OSATs to ensure mass production readiness.