New Grad Packaging Integration Engineer (2.5D/3D)

GlobalFoundries inc.; Essex (MD); Híbrido; USD 85.000 - 146.000; Jornada completa

Descripción de la vacante

GlobalFoundries seeks a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support the development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The role entails package integration, process development, reliability characterization, and data analysis, gaining hands-on experience in silicon photonics,

Formación

• Overall GPA of at least 3.0 and good academic standing.
• Basic understanding of semiconductor packaging and silicon photonics.
• Experience analyzing experimental data.
• Ability to work effectively within cross-functional teams.
• English language fluency (written & verbal).

Responsabilidades

• Support assembly process integration activities for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification activities for new package technologies.
• Analyze engineering and manufacturing data to identify process improvement opportunities.
• Participate in failure analysis and root cause investigations for packaging and assembly-related issues.
• Support package reliability testing and characterization activities.
• Collaborate with design, product, manufacturing, quality, and supplier teams to address technical challenges.

Conocimientos

Analytical skills

Problem solving

Cross-functional teamwork

English fluency

Educación

Materials Science Engineering (B.S./M.S./PhD)

Herramientas

DOE methodologies

Statistical data analysis

Descripción del empleo

GlobalFoundries seeks a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support the development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

The role entails package integration, process development, reliability characterization, and data analysis, gaining hands-on experience in silicon photonics,