Senior 2.5D/3D Packaging Architect

Broadcom; San Jose (CA); On-site; USD 190,000 - 260,000; Full time

Job summary

Broadcom in San Jose, CA seeks a senior packaging leader to drive 2.5D/3D advanced packaging developments. You will shape cost-effective, high-performance solutions while coordinating with silicon, package design, marketing, NPI, and suppliers.

You will lead cross-functional teams, manage NPI and sourcing, and ensure design rules, signal integrity, thermal performance, and reliability targets are met on schedule. A Ph.D.

Qualifications

• Ph.D./M.S. in Mechanical, Electrical, or Electronics Engineering with 10+ years of relevant experience.
• Proven track record in developing cost-effective, high-performance 2.5D/3D packaging.
• Experience with large, complex substrates, interposers, and wafer-level packaging.

Responsibilities

• Lead development of cost-effective, high-performance packaging solutions.
• Define needs with customers and partners; drive unified solutions.
• Collaborate with Design Integration, Package Design, and Test Development.
• Support NPI and sourcing; manage high-volume manufacturing ramps.

Skills

2.5D/3D packaging

Cross-functional collaboration

Project management

Thermal‑mechanical modelling

Education

PhD or MSc in Mechanical, Electrical, or Electronics Engineering

Tools

APD

AutoCAD

SolidWorks

Job description

Broadcom in San Jose, CA seeks a senior packaging leader to drive 2.5D/3D advanced packaging developments. You will shape cost-effective, high-performance solutions while coordinating with silicon, package design, marketing, NPI, and suppliers.

You will lead cross-functional teams, manage NPI and sourcing, and ensure design rules, signal integrity, thermal performance, and reliability targets are met on schedule. A Ph.D.