Senior Optical Packaging Engineer – SiPh & 3D HI

GlobalFoundries; Essex Junction (VT); On-site; USD 148,000 - 247,000; Full time

Job summary

GlobalFoundries is seeking a Packaging Engineer to lead optical packaging development for silicon photonics and co-packaged optics. You will coordinate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, cost-effective packaging designs.

Responsibilities include defining architectures, enabling high-density fiber-to-chip coupling, and driving 2.5D/3D packaging integration.

Qualifications

• 8+ years in semiconductor packaging, with a focus on photonic or advanced packaging.
• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Experience bringing packaged products from development into production.

Responsibilities

• Define, design, and qualify optical packaging architectures for SiPh-based modules, including fiber attach and thermal/mechanical integration.
• Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
• Drive HI of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu bonding).
• Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance.
• Lead root cause analysis and corrective actions for yield and reliability using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction aligned with GF’s supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.

Skills

Analytical thinking

Problem solving

Communication skills

English communication

Cross-functional collaboration

Education

Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field

Tools

Lumerical

COMSOL

Python

Job description

GlobalFoundries is seeking a Packaging Engineer to lead optical packaging development for silicon photonics and co-packaged optics. You will coordinate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, cost-effective packaging designs.

Responsibilities include defining architectures, enabling high-density fiber-to-chip coupling, and driving 2.5D/3D packaging integration.