Senior Optical Packaging Engineer – SiPh & CPO

GLOBALFOUNDRIES U.S. INC.

Essex Junction (VT)

On-site

USD 143,000 - 247,000

Full time

14 days+
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Job summary

GLOBALFOUNDRIES U.S. INC. is seeking a Packaging Engineer within its Integrated Optics organization to lead development and sustainment of advanced optical packaging for silicon photonics and co‑packaged optics.

You will drive fiber-to-chip coupling, 2.5D/3D packaging, and cross‑functional collaboration across photonics, electrical, mechanical, and manufacturing teams. The role requires a Master’s degree in a relevant field, 8+ years of packaging experience, and strong English communication.

Qualifications

  • Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, Optical Engineering or related field.

Responsibilities

  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach and thermal/mechanical integration.
  • Develop scalable fiber-to-chip coupling strategies for high-density optical I/O.
  • Drive HI (2.5D/3D/3.5D) packaging technologies and advanced molded integration.
  • Perform multiphysics simulations to optimize package performance and reliability.
  • Lead root cause analysis for yield and reliability using FMEA, DOE, FA tools.
  • Collaborate with OSATs and internal teams for mass production readiness and process transfer.
  • Support cost modeling and drive packaging cost reduction initiatives.
  • Present technical updates and roadmaps to stakeholders and partners.

Skills

Analytical
Communication
English proficiency

Education

Master's degree or higher in Packaging/Materials Science/Engineering

Tools

Lumerical
COMSOL
Python

Job description

GLOBALFOUNDRIES U.S. INC. is seeking a Packaging Engineer within its Integrated Optics organization to lead development and sustainment of advanced optical packaging for silicon photonics and co‑packaged optics.

You will drive fiber-to-chip coupling, 2.5D/3D packaging, and cross‑functional collaboration across photonics, electrical, mechanical, and manufacturing teams. The role requires a Master’s degree in a relevant field, 8+ years of packaging experience, and strong English communication.

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