An application made for this job — a tailored resume and cover letter that speak straight to the posting.
GLOBALFOUNDRIES U.S. INC. is seeking a Packaging Engineer within its Integrated Optics organization to lead development and sustainment of advanced optical packaging for silicon photonics and co‑packaged optics.
You will drive fiber-to-chip coupling, 2.5D/3D packaging, and cross‑functional collaboration across photonics, electrical, mechanical, and manufacturing teams. The role requires a Master’s degree in a relevant field, 8+ years of packaging experience, and strong English communication.
GLOBALFOUNDRIES U.S. INC. is seeking a Packaging Engineer within its Integrated Optics organization to lead development and sustainment of advanced optical packaging for silicon photonics and co‑packaged optics.
You will drive fiber-to-chip coupling, 2.5D/3D packaging, and cross‑functional collaboration across photonics, electrical, mechanical, and manufacturing teams. The role requires a Master’s degree in a relevant field, 8+ years of packaging experience, and strong English communication.