Senior Photonic Packaging & Integration Engineer

Cisco

San Jose (CA)

On-site

USD 155,000 - 225,000

Full time

2 days ago

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Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401k match

Parental leave

Disability insurance

Life insurance

Job summary

Cisco Systems is seeking an Advanced Packaging engineer to join the Packaging Technology & Quality team, driving 2.5D/3D packaging, heterogenous integration, and optical engine packaging for silicon photonics.

You will collaborate with OSATs, foundries, and suppliers to develop robust packaging solutions, guide DfM and DfR, and solve complex integration challenges across multi-functional teams in a global supply chain.

Qualifications

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or related field.
4+ years in advanced packaging with high-density integration.
Knowledge of ultra-fine pitch technologies and hybrid bonding.
Hands-on CAD experience: kLayout, APD, SolidWorks.

Responsibilities

Advanced packaging technology development focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking and heterogeneous integration.
Drive definition, design and analysis of packaging technology test vehicles and validate new technology against key performance metrics.
Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, and advanced substrate development.