Senior SiPh Packaging & Assembly Lead

GlobalFoundries inc.; Essex (VT); Hybrid; USD 167,000 - 290,000; Full time

Job summary

GlobalFoundries seeks a DMTS-grade expert to advance the Si Photonics packaging platform, delivering fully packaged electro‑optical transceivers and 2.5D/3D co-packaged optics. You will define reliability plans, materials criteria, and test methodologies for chiplet modules in data centers, automotive, and communications.

The role requires leadership and collaboration with OSAT ecosystems, a track record of moving packaged photonic/electronic products from development to production, and a strong

Qualifications

• Advanced degree in a related field; MS or PhD with extensive experience (20+ yrs) preferred.
• Expertise in photonic and electronic package architecture and integration.
• Experience bringing packaged products from development to production for data centers, automotive and communications.

Responsibilities

• Lead SiPhotonics packaging efforts and answer internal/external questions.
• Train engineers in packaging design reviews, material selection, and FMEAs.
• Ensure quality and reliability standards for new technologies in data centers, automotive, and communications.
• Drive global leadership in SiPh packaging innovations and supplier collaborations.
• Support environmental, health, safety and security programs.

Skills

Photonic/electronic packaging

Package architecture

Leadership in packaging engineering

Education

MS or PhD

Tools

Simulation software

Job description

GlobalFoundries seeks a DMTS-grade expert to advance the Si Photonics packaging platform, delivering fully packaged electro‑optical transceivers and 2.5D/3D co-packaged optics. You will define reliability plans, materials criteria, and test methodologies for chiplet modules in data centers, automotive, and communications.

The role requires leadership and collaboration with OSAT ecosystems, a track record of moving packaged photonic/electronic products from development to production, and a strong