Senior Silicon Photonics & 3D Packaging Engineer

Cisco Systems, Inc.; San Jose (CA); On-site; USD 155,000 - 225,000; Full time

Job summary

Cisco Systems, Inc. is seeking an Advanced Packaging engineer to join the Packaging Technology & Quality team in the Global Supply Chain. You will drive development of packaging technologies for silicon photonics, including heterogeneous integration, co-packaged optics, and on-board optics.

You will collaborate with OSATs, foundries, and suppliers to shape technology roadmaps and ensure robust packaging solutions, with emphasis on DfM, DfR, and risk mitigation across multi-functional teams.

Qualifications

• PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field.
• 4+ years of progressive industry experience in advanced packaging with a proven track record of successful project execution in high-density integration.
• Comprehensive knowledge of advanced interconnect materials, process and assembly, including ultra-fine pitch technologies and hybrid bonding.
• Hands-on experience with CAD tools such as kLayout, APD, Solidworks.

Responsibilities

• Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogenous integration, and ultra-fine pitch interconnect technologies.
• Drive definition, design and analysis of packaging technology test vehicles. Drive validation of new technology against key performance metrics.
• Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly.
• Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics.
• Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR).
• Identify and mitigate risks, resolving highly complex packaging issues through advanced root cause analysis and the implementation of corrective actions.

Skills

4+ years advanced packaging experience

Education

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or related field

Tools

kLayout

APD

SolidWorks

Job description

Cisco Systems, Inc. is seeking an Advanced Packaging engineer to join the Packaging Technology & Quality team in the Global Supply Chain. You will drive development of packaging technologies for silicon photonics, including heterogeneous integration, co-packaged optics, and on-board optics.

You will collaborate with OSATs, foundries, and suppliers to shape technology roadmaps and ensure robust packaging solutions, with emphasis on DfM, DfR, and risk mitigation across multi-functional teams.