Senior Silicon Packaging Engineer – Advanced Packaging

Meta; Sunnyvale (CA); Hybrid; USD 180,000 - 260,000; Full time

Job summary

Reality Labs is seeking a Silicon Packaging Technology Engineer to drive advanced packaging technology from concept through productization for next-generation consumer hardware. The role requires deep expertise in packaging technologies, cross-functional collaboration with OSATs and vendors, and the ability to optimize designs under thermal and mechanical constraints.

The ideal candidate will have 12+ years in packaging development, strong DOE and data analysis skills, and a track record of

Qualifications

• Bachelor's degree in Computer Science, Electrical/Mechanical/Materials Engineering, or equivalent.
• 12+ years in advanced silicon packaging development, process integration, and manufacturing.
• Experience co-optimizing package architecture with mechanical and thermal constraints.
• Cross-functional collaboration with foundries, OSATs, substrate vendors, and ODMs.
• Experience taking products from concept to prototyping and production with specs, qualifications, and yield/cost optimization.
• Master's or PhD in a relevant engineering discipline.
• Experience with reliability testing and qualification (JEDEC standards).
• Strong DOE methodology and statistical data analysis skills.
• Experience performing failure analysis and root cause determination.

Skills

Cross-functional collaboration

Problem solving

Communication skills

Root cause determination

DOE methodology

Statistical data analysis

Package qualification with OSATs

Travel internationally

Packaging technology knowledge

Education

Bachelor's degree in Computer Science

Bachelor's degree in Electrical/Mechanical/Materials Engineering

Master's or PhD in a relevant engineering discipline

Tools

WLCSP

Fan-out RDL

WoW

CoW

PoP

SiP

Flip chip

3D stacking

Chip-package interaction (CPI)

Job description

Reality Labs is seeking a Silicon Packaging Technology Engineer to drive advanced packaging technology from concept through productization for next-generation consumer hardware. The role requires deep expertise in packaging technologies, cross-functional collaboration with OSATs and vendors, and the ability to optimize designs under thermal and mechanical constraints.

The ideal candidate will have 12+ years in packaging development, strong DOE and data analysis skills, and a track record of