Senior Packaging Engineer

Charlesbrownrecruitment; United States; On-site; USD 90,000 - 120,000; Full time

Job summary

A leading pre-IPO technology firm is looking for a Senior Packaging Engineer to lead the development of innovative packaging technologies for power semiconductor devices. This role involves driving package technology from concept through production, collaborating cross-functionally, and ensuring competitive advantages through strategic decisions. Candidates should have an MS or PhD in Mechanical Engineering or Materials Science, along with deep expertise in thermal and thermo-mechanical simulation tools. Strong program management and collaboration skills are essential.

Qualifications

• Deep expertise in thermal and thermo-mechanical simulation and modeling tools.
• Strong knowledge of semiconductor packaging processes and materials.
• Experience with power semiconductor packages (TO, DFN/QFN, TOLL, power modules).

Responsibilities

• Lead package technology development from concept through production.
• Drive thermal and thermo-mechanical modeling initiatives.
• Develop innovative packaging architectures for power semiconductor devices.

Skills

Thermal and thermo-mechanical simulation

Package development

Cross-functional collaboration

Program management

Education

MS or PhD in Mechanical Engineering

Materials Science

Job description

We are a pre-IPO company experiencing strong growth driven by groundbreakingpower discrete technologies that are redefining what’s possible in siliconpower devices. As Senior Packaging Engineer, you will lead package technologydevelopment from concept through production, driving strategic decisions thatdirectly impact competitive advantage.

Responsibilities

• Lead package technology development from concept through production
• Drive thermal and thermo-mechanical modeling initiatives
• Develop innovative packaging architectures for power semiconductor devices
• Collaborate cross-functionally with Design, Applications, Marketing, Quality, and Operations teams
• Design and execute experiments to optimize packaging processes and materials
• Work with OSAT partners on NPI and package development
• Contribute to intellectual property creation and technology roadmaps

Requirements

• MS or PhD in Mechanical Engineering, Materials Science, or related field
• Deep expertise in thermal and thermo-mechanical simulation and modeling tools
• Strong knowledge of semiconductor packaging processes and materials
• Experience with power semiconductor packages (TO, DFN/QFN, TOLL, power modules)
• Familiarity with JEDEC specifications and qualification requirements
• Strong program management and cross-functional collaboration skills
• Experience with DOE, statistical analysis, and reliability evaluation