Principal Mechanical Engineer: Advanced Packaging Architect

AMD; San Jose (CA); On-site; USD 180,000 - 270,000; Full time

Job summary

AMD seeks a Principal Mechanical Engineer to lead advanced packaging solutions, spanning concept through production ramp. You will drive mechanical design, simulations, and qualification while collaborating across silicon, packaging, thermal, reliability, and manufacturing teams to deliver industry-leading technologies.

The ideal candidate has MS or PhD in engineering, hands-on experience with 2.5D/3D packaging, and a track record of technical leadership in high‑volume semiconductor

Qualifications

• MS or PhD in Mechanical Engineering or related field.
• Experience with advanced packaging in semiconductor hardware.
• Ability to lead design reviews and mentor engineers.

Responsibilities

• Perform and lead mechanical architecture and design strategy for advanced semiconductor packaging solutions.
• Perform and drive mechanical design, CAD development, and thermo‑mechanical analysis from concept through production.
• Perform and guide stress, warpage, reliability, and package‑board interaction modeling using FEA tools.
• Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
• Conduct and lead qualification, failure analysis, and root‑cause investigations across NPI and production.
• Establish design guidelines, mechanical specifications, and manufacturing requirements for advanced packaging technologies.

Skills

Technical leadership

Mechanical design

Stress analysis

Cross-functional collaboration

Mentoring

Education

MS in Mechanical Engineering

PhD in Mechanical/Materials/Electrical/Applied Mechanics (or related)

Bachelor's degree with-equivalent industry experience

Tools

ANSYS Mechanical

Creo

SolidWorks

Job description

AMD seeks a Principal Mechanical Engineer to lead advanced packaging solutions, spanning concept through production ramp. You will drive mechanical design, simulations, and qualification while collaborating across silicon, packaging, thermal, reliability, and manufacturing teams to deliver industry-leading technologies.

The ideal candidate has MS or PhD in engineering, hands-on experience with 2.5D/3D packaging, and a track record of technical leadership in high‑volume semiconductor