Principal Advanced Packaging Engineer (Hybrid)
Renesas Electronics
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Benefits offered by this job
Job summary
Renesas Electronics in San Jose is seeking a Principal Package Design Engineer to lead next-generation packaging for high-performance semiconductors. You will drive architecture, simulation, and qualification, interfacing with design, manufacturing, and suppliers to ensure robust, scalable solutions.
The role emphasizes hands-on development, collaboration across teams, and leadership in packaging initiatives, with opportunities to influence AI infrastructure and data center power applications.
Qualifications
- MSc or PhD in Electrical Engineering or related field.
- 5+ years in advanced semiconductor packaging or electronics packaging.
- Strong hands-on knowledge of packaging technologies, materials, and integration for AI infrastructure.
- Experience with OSATs, supply chains, and qualification standards.
Responsibilities
- Lead design, development, and qualification of advanced packaging solutions.
- Define architecture with electrical, thermal, mechanical, and cost requirements.
- Collaborate with IC design, substrate, thermal, reliability, and manufacturing teams.
- Develop assembly flows and qualification activities with OSATs.
- Mentor engineers and lead packaging initiatives.
Skills
Education
Tools
Job description
Renesas Electronics in San Jose is seeking a Principal Package Design Engineer to lead next-generation packaging for high-performance semiconductors. You will drive architecture, simulation, and qualification, interfacing with design, manufacturing, and suppliers to ensure robust, scalable solutions.
The role emphasizes hands-on development, collaboration across teams, and leadership in packaging initiatives, with opportunities to influence AI infrastructure and data center power applications.
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