Senior Packaging Substrate Engineer | Hybrid

Advanced Micro Devices; Austin (TX); Hybrid; USD 150,000 - 190,000; Full time

Job summary

Advanced Micro Devices is seeking a packaging technology lead to drive the development of substrate and board technologies that support the company’s product roadmap. You will guide cross-functional teams, coordinate with architects, designers, and suppliers to deliver high-yield, cost-effective solutions from concept through NPI.

The ideal candidate has hands-on experience in packaging, materials, and equipment, with a track record of delivering advanced substrate innovations in OSAT, fabless,

Qualifications

• Hands-on leadership in cross-functional teams to certify technology, reduce yield/cost, and set up equipment.
• Ability to communicate complex technical challenges to executives; deep knowledge of packaging and board design rules.

Responsibilities

• Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors.
• Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements.
• Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
• Partner with product, quality and manufacturing engineering teams to meet milestones for manufacturability, yield and reliability from concept through NPI.
• Qualify package substrates of new products meeting cost and yield targets.

Skills

Cross-functional leadership

Technical communication

Packaging & board design knowledge

Education

BS/MS/PhD in solid state physics, Chemistry, Materials science, Chemical engineering or equivalent

Job description

Advanced Micro Devices is seeking a packaging technology lead to drive the development of substrate and board technologies that support the company’s product roadmap. You will guide cross-functional teams, coordinate with architects, designers, and suppliers to deliver high-yield, cost-effective solutions from concept through NPI.

The ideal candidate has hands-on experience in packaging, materials, and equipment, with a track record of delivering advanced substrate innovations in OSAT, fabless,