Senior Package Architect, Semiconductor Packaging

Intel Corporation; Hillsboro (OR); Hybrid; USD 191,000 - 269,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon seeks a Silicon Packaging Architect to lead end-to-end package solutions that meet electrical, thermal, and cost targets. You will drive design through production readiness, troubleshoot issues, and work with silicon, hardware, and manufacturing teams to ensure smooth tape-out transitions.

The role requires advanced degrees and 9+ years hands-on experience (or 6+ with masters, 4+ with PhD), expertise in DFM and DOE, and ability to guide cross-functional teams in a

Qualifications

• Bachelor's degree with 9+ years hands-on experience in package architectures and technical documentation.
• Master's degree with 6+ years hands-on experience in packaging
• PhD with 4+ years hands-on experience in semiconductor/electronic packaging and related DOE/DFM practices

Responsibilities

• Translate product requirements into detailed package architecture specifications.
• Lead technology trade-off decisions to meet electrical, mechanical, thermal, and reliability standards.
• Collaborate with silicon, hardware, and package leads to deliver high-quality outputs and remove roadblocks.
• Oversee the packaging development process from design to production readiness and drive quality improvements.
• Apply DOE methodologies to troubleshoot package designs and manufacturing issues.
• Partner with manufacturing to ensure smooth design-to-production transitions and tape-out readiness.
• Utilize Design for Manufacturing (DFM) principles to optimize manufacturability and production efficiency.
• Maintain and refine technical documentation supporting package development processes

Skills

Package architecture

DFM principles

DOE methodologies

Troubleshooting

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Electrical Eng or Materials Science

Master's degree in a relevant field

PhD in a relevant field

Job description

Intel Corporation in Oregon seeks a Silicon Packaging Architect to lead end-to-end package solutions that meet electrical, thermal, and cost targets. You will drive design through production readiness, troubleshoot issues, and work with silicon, hardware, and manufacturing teams to ensure smooth tape-out transitions.

The role requires advanced degrees and 9+ years hands-on experience (or 6+ with masters, 4+ with PhD), expertise in DFM and DOE, and ability to guide cross-functional teams in a