Senior RF & Wireless Hardware Engineer (Chip-Down) Remote

Axon

United States

Hybrid

USD 113,000 - 197,000

Full time

42 hours ago
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Benefits offered by this job

Competitive salary
401k with employer match
Discretionary paid time off
Paid parental leave
Medical, dental, and vision plans
Fitness Programs
Emotional & Mental Wellness support
Snacks in offices

Job summary

Axon seeks a Senior Electrical Engineer to own design, development, and validation of complex RF/legacy wireless hardware for mission-critical devices. You will join as a founding member of the hardware team, shaping architecture and standards for scalable hardware.

The role spans schematics, RF integration, mechanical fit, and production readiness, with travel up to 50% and relocation support for US-based candidates.

Qualifications

  • 7+ years of embedded electronics design experience.
  • Experience with PCB design and RF coexistence in highly integrated devices.
  • Experience bringing up hardware, debugging, and validation.
  • Ability to lead hardware objectives and review designs.

Responsibilities

  • Develop mixed-signal schematics and PCB layout for RF/HW.
  • Design and validate RF transceivers and radio systems.
  • Coordinate with Mechanical/Industrial Design for form factor.
  • Bring up, characterize, and troubleshoot hardware with test equipment.
  • Drive BOMs, design docs, and production readiness.
  • Provide technical leadership to team and partners.

Skills

Embedded electronics design
RF integration & coexistence
Board design & layout
Hardware bring-up/debugging
Technical leadership
Cross-functional collaboration
Travel up to 50%

Education

Bachelor's degree in electrical engineering

Tools

Cadence OrCAD
Allegro

Job description

Axon seeks a Senior Electrical Engineer to own design, development, and validation of complex RF/legacy wireless hardware for mission-critical devices. You will join as a founding member of the hardware team, shaping architecture and standards for scalable hardware.

The role spans schematics, RF integration, mechanical fit, and production readiness, with travel up to 50% and relocation support for US-based candidates.

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