Senior RF Hardware Engineer - Chip-Down & Wireless Systems

BOSTON TRUST WALDEN COMPANY; United States; Hybrid; USD 113,000 - 197,000; Full time

Benefits offered by this job

401k with employer match

Discretionary paid time off

Paid parental leave

Medical, dental, and vision plans

Fitness Programs

Emotional & Mental Wellness support

Learning & Development programs

Snacks in our offices

Job summary

Axon seeks a Senior Electrical Engineer specializing in RF hardware to own multi-transceiver systems for field-ready devices. You will drive architecture decisions, select chipsets, and lead bring-up and validation from schematic to mass production.

You will collaborate with Antenna, Mechanical, Firmware, and Systems teams to optimize RF coexistence, isolation, EMI/EMC, and overall performance across LTE/5G, Wi‑Fi, and Bluetooth platforms.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 7+ years in embedded wireless hardware/RF design.
• Experience with chip-down RF design and board integration.

Responsibilities

• Own RF hardware architecture and board-level integration for multi-transceiver systems.
• Translate requirements into wireless hardware architectures and evaluate chipsets and interfaces.
• Lead schematic capture and PCB implementation for RF transceivers, modem front-ends, and power circuitry.
• Design and validate RF coexistence, interference control, and EMI/EMC in compact devices.
• Collaborate with Antenna, Mechanical, Firmware, and Systems teams to optimize RF performance.
• Lead bring-up, debugging, and certification activities through manufacturing ramp.

Skills

Embedded wireless hardware

RF design

LTE/5G cellular

Wireless coexistence

Schematic capture

PCB layout

Test & debugging equipment

Travel up to 50%

Education

Bachelor's degree in Electrical Engineering

Tools

Cadence OrCAD/Allegro

Job description

Axon seeks a Senior Electrical Engineer specializing in RF hardware to own multi-transceiver systems for field-ready devices. You will drive architecture decisions, select chipsets, and lead bring-up and validation from schematic to mass production.

You will collaborate with Antenna, Mechanical, Firmware, and Systems teams to optimize RF coexistence, isolation, EMI/EMC, and overall performance across LTE/5G, Wi‑Fi, and Bluetooth platforms.