Senior RF & Wireless Hardware Engineer — Hybrid

Colorado Psychiatric; New York (NY); Hybrid; USD 113,000 - 197,000; Full time

Benefits offered by this job

401k with employer match

Paid time off

Parental leave

Medical, dental, and vision plans

Fitness programs

Emotional & mental wellness support

Learning & development

Snacks in offices

Job summary

Axon is seeking a Senior Electrical Engineer focused on RF hardware and chip-down design to own architecture, integration, development, and validation of sophisticated multi-transceiver systems for connected devices.

You will help define how multiple wireless technologies coexist within compact, battery-powered hardware, leading bring-up, validation, and production activities while collaborating with cross-functional teams.

Qualifications

• 7+ years of embedded wireless hardware and/or RF electronics design experience with a bachelor's degree in Electrical Engineering or a related discipline.
• Demonstrated experience with chip-down RF design and board-level integration of wireless transceivers/modems, rather than solely integrating pre-certified modules.
• Significant design experience with two or more relevant wireless technologies, including mission-critical communications, LTE/5G cellular, broadband wireless, Wi-Fi, Bluetooth, GNSS, or similar wireless systems.
• Experience designing and debugging RF-related circuitry, including transceivers, RF front ends, filtering, matching, switching, amplification, clocks, power delivery, and digital control interfaces.
• Strong understanding of RF coexistence, interference, desense, isolation, harmonics, spurious emissions, grounding, shielding, and EMI/EMC in compact multi-transceiver products.
• Demonstrated expertise integrating multiple transceivers into compact, highly integrated, battery-powered hardware.
• Hands‑on experience with schematic capture and directing PCB layout using Cadence OrCAD and Allegro or comparable professional design tools.
• Substantial hands‑on hardware bring‑up and debugging experience using wireless communications testers, spectrum analyzers, oscilloscopes, network analyzers, signal generators, power supplies, and related RF/electrical test equipment.
• Experience partnering with antenna, mechanical, firmware, and systems engineers to optimize end‑to‑end wireless performance.
• Proven experience taking wireless hardware from concept and architecture through validation, certification, manufacturing ramp, and mass production.
• Experience with applicable U.S. and international wireless, EMC, regulatory, carrier, or safety certification requirements.
• Proven experience working directly with silicon and chipset vendors, ODMs, JDMs, CMs, and external engineering partners.
• Flexibility to travel domestically up to 50% of the time, as needed, to support the team.

Responsibilities

• RF & Chip-Down Design: Own board-level implementation and integration of RF chipsets and associated circuitry across mission-critical communications, LTE/5G cellular, broadband wireless, and other wireless technologies.
• Wireless Architecture: Translate system and product requirements into wireless hardware architectures, evaluating chipsets, transceivers, front-end components, interfaces, power requirements, and system-level tradeoffs.
• Schematic & PCB Implementation: Develop and review schematics and PCB implementations for RF transceivers, modems, front-end components, power circuitry, control interfaces, and supporting digital electronics.
• RF Coexistence & Interference: Design and validate multi-transceiver systems, addressing coexistence, desense, interference, isolation, harmonics, spurious emissions, grounding, shielding, and EMI/EMC.
• Multi-Transceiver Integration: Solve hardware challenges associated with integrating mission-critical communications, cellular, and other wireless technologies within compact devices.
• RF & Antenna Integration: Partner with Antenna, Mechanical, Industrial Design, and other teams to optimize antenna placement, RF routing, shielding, grounding, PCB layout, and overall product RF performance.
• Bring-Up & Debugging: Lead wireless hardware bring-up, characterization, and root-cause analysis using wireless communications testers, spectrum analyzers, oscilloscopes, network analyzers, signal generators, power meters, and related RF test equipment.
• Certification & Production: Drive wireless hardware through verification, regulatory and carrier certification, SP/EVT/DVT/PVT, manufacturing ramp, and mass production.
• Technical Leadership: Provide technical direction on wireless hardware architecture and design while working with chipset vendors, external design partners, ODMs/JDMs, and internal engineering teams.

Skills

RF hardware design

Chip-down RF design

Schematic capture

PCB layout

Cadence OrCAD/Allegro

RF test equipment

System integration

Technical leadership

Travel up to 50%

Education

Bachelor's degree in Electrical Engineering

Tools

Cadence OrCAD

Allegro

Job description

Axon is seeking a Senior Electrical Engineer focused on RF hardware and chip-down design to own architecture, integration, development, and validation of sophisticated multi-transceiver systems for connected devices.

You will help define how multiple wireless technologies coexist within compact, battery-powered hardware, leading bring-up, validation, and production activities while collaborating with cross-functional teams.